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UXB02070G4TR100中文资料(3)

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The result of the determined production is verified by anaccelerated ageing (burn-in) and extensive testingprocedure performed on 100 % of the individual resistors.Only accepted products are stuck directly on the adhesivetapes in accordance with IEC 60286-1.

Document Number: 28726Revision: 21-Aug-07

ASSEMBLY

The resistors are suitable for processing on automaticinsertion equipment and cutting and bending machines.Excellent solderability is proven, even after extendedstorage. They are suitable for automatic soldering usingwave or dipping. The encapsulation is resistant to allcleaning solvents commonly used in the electronics industry,including alcohols, esters and aqueous solutions. Thesuitability of conformal coatings, if applied, shall be qualifiedby appropriate means to ensure the long-term stability of thewhole system.

APPROVALS

Where applicable, the resistors are tested in accordance withCECC40101-806 which refers to EN 60115-1 and EN 140100.

Vishay BYSCHLAG has achieved "Approval ofManufacturer" in accordance with EN 100114-1

87

UXA 0204, UXB 0207, UXE 0414

Vishay Beyschlag

FUNCTIONAL DESCRIPTION

High Precision Leaded Resistors

Derating - Precision Operation

Temperature Rise

88

Document Number: 28726

Revision: 21-Aug-07

UXA 0204, UXB 0207, UXE 0414

High Precision Leaded Resistors

Vishay Beyschlag

TESTS AND REQUIREMENTS

Essentially all tests are carried out in accordance with thefollowing specifications:

EN 140000/IEC 60115-1, Generic specification (includestests)

EN 140100/IEC 60115-2, Sectional specification (includesschedule for qualification approval)

CECC 40101-806, Detail specification (includes schedule forconformance inspection)

Most of the components are approved in accordance with theuropean CECC-system, where applicable. The TestProcedures and Requirements table contains only the mostimportant tests. For the full test schedule refer to thedocuments listed above. The testing also covers most of therequirements specified by EIA/IS-703 and JIS-C-5202.The tests are carried out in accordance with IEC 60 068 andunder standard atmospheric conditions in accordance with

IEC 60068-1, 5.3. Climatic category LCT/UCT/56 (ratedtemperature range: Lower Category Temperature, UpperCategory Temperature; damp heat, long term, 56 days) isvalid.

Unless otherwise specified the following values apply:Temperature: 15 °C to 35 °CRelative humidity: 45 % to 75 %

Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).For testing the components are mounted on a test board inaccordance with IEC60115-1, 4.31 unless otherwisespecified.

In the Test Procedures and Requirements table only thetests and requirements are listed with reference to therelevant clauses of IEC 60115-1 and IEC60068-2; a shortdescription of the test procedure is also given.

TEST PROCEDURES AND REQUIREMENTS

IEC 60115-1CLAUSE

IEC60068-2TESTMETHOD

TEST

PROCEDURE

REQUIREMENTS

PERMISSIBLE CHANGE (ΔR)

Stability for product types:

UXA 0204UXB 0207UXE 0414

4.5

-resistance (ΔR/R)temperature coefficient

at 20/LCT/20 °C and 20/UCT/20 °C

room temperature;

U70 or

Umax;1.5 h on; 0.5 h off70°C; 2000 h85°C; 1000 h85°C; 8000 h

± (0.05 %R +0.01Ω)± (0.02 %R +0.01Ω)± (0.04 %R +0.01Ω)

± (0.05 %R +0.01Ω)± (0.03 %R +0.01Ω)± (0.06 %R +0.01Ω)

± (0.05 %R+0.01Ω)±(0.04%R+0.01Ω)±(0.08%R+0.01Ω)

100 Ω to 100 kΩ100 Ω to 250 kΩ100 Ω to 100 kΩ

22Ω to < 100Ω;> 100 kΩ to 221 kΩ 40.2Ω to < 100 Ω;> 250kΩ to 301 kΩ22Ω to < 100 Ω;> 100kΩ to 511 kΩ

-10Ω to < 40.2 Ω;> 301 kΩ to 1 MΩ

-

± 0.25 %; ± 0.1 %; ± 0.05 %; ± 0.01 %

4.8.4.2-± 10 ppm/K; ± 05 ppm/K; ± 02 ppm/K

4.25.1-endurance

Document Number: 28726Revision: 21-Aug-07

89

UXA 0204, UXB 0207, UXE 0414

Vishay Beyschlag

High Precision Leaded Resistors

TEST PROCEDURES AND REQUIREMENTS

IEC 60115-1CLAUSE

IEC60068-2TESTMETHOD

TEST

PROCEDURE

REQUIREMENTS

PERMISSIBLE CHANGE (ΔR)

Stability for product

types:

UXA 0204UXB 0207UXE 0414

endurance at

upper category temperaturedamp heat,steady stateclimatic sequence:

2 (Ba)

dry heatdamp heat, cyclic

coldlow air pressuredamp heat, cyclic

125°C; 16h 55°C; 24h;90% to100%RH;

1 cycle

- 55 °C; 2h8.5kPa;2h;15 °Cto35°C55°C; 5days;95% to100%RH;

5 cyclesroom temperature;U= 2.5 x 70 orU = 2xmax; 5 s30minutes at LCT and30minutes at UCT;

5cyclesisopropyl alcohol + 23 °C; toothbrush

methodunmounted components; (260± 5)°C; (10± 1)s+ 235°C; 2 s solder

bath method

± (0.04 %R +0.01 Ω)no visible damage

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