Philips QMP rev 1.2(54701)(4)

9. GLOSSARY OF ACRONYMS

AFR CA CP CTQ

Annualized Failure Rate Corrective Action Change Proposal

Component Technology & Quality

BCUM Business Creation Unit Monitors

CLCA Closed Loop Corrective Action DPPM Defect Parts Per Million EC FAI FN

Engineering Change First Article Inspection Factory Notice

FMEA Failure Mode Effect Analysis FCR Field Call Rate

GR&R Gauge Repeatability and Reproducibility IQC IP JQE OBA OQC

Incoming Quality Control Initial Purchasing Joint Quality Engineer Out of Box Audit Outgoing Quality Control

LSQA Local Supplier Quality Assurance

ORT Ongoing Reliability Test MP Mass Production

NPRR New Product Readiness Review PA PQE QMP QPA QSA SPC SQA

Preventive Action

Product Quality Evaluation Quality Management Plan Quality Process Audit Quality System Audit Statistical Process Control Supplier Quality Assurance

PCBA Printed Circuit Board Assembly

Appendices

APPENDIX A

APPENDIX a Process Flow Supplier Manufacturing Site Locations

APPENDIX B

APPENDIX C

APPENDIX D

APPENDIX E

APPENDIX E1

APPENDIX E2

APPENDIX E3

APPENDIX F

APPENDIX f – Quality Report format

Critical Contact Matrix

JQE Audit Report & Schedule

Critical Components

Statistical Data for Key Parameters

Process FMEA Product FAI Critical Components FAI List of Gauges/ Gauge R&R

APPENDIX G

APPENDIX H

APPENDIX I

APPENDIX J

APPENDIX K

APPENDIX L

APPENDIX M

APPENDIX N

APPENDIX O

APPENDIX P

APPENDIX Q

APPENDIX R

EC/CP/FN Log Sheet

IQC Sampling Plan Matrix

Critical Component Incoming Quality Report

Weekly In-Process Quality Report

Monthly In-Process Quality Report

In Process Critical Component Quality Status

ORT Monthly Quality Report

Weekly Out-Going Quality Report

Monthly Out-Going Quality Report

OBA Weekly Report

Line Stop & Stop Ship Report

CLCA Log

APPENDIX S

APPENDIX T

CLCA Manual Form

New Product Readiness Checklist

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