Alpha 锡膏OM340EN规格书英文版

FINE FEATURE, ZERO HALOGEN1, LOW HEAD IN PILLOW DEFECT, HIGHLY PIN TESTABLE

DESCRIPTION

ALPHAOM-340 - NO-CLEAN, LEAD-FREE SOLDER PASTE

®

ALPHA OM-340 is a lead-free, no-clean solder paste designed for a broad range of applications. ALPHA OM-340 provides best in class low defect rate for Head in Pillow defects combined with excellent first pass yield on ICT/pin testing. ALPHA OM-340 also yields excellent print capability performance across various board designs and, particularly, with ultra fine feature repeatability and high “through-put” applications.

Outstanding reflow process window delivers superior soldering on CuOSP with excellent coalescence on a broad range of deposit sizes, excellent random solder ball resistance and mid-chip solder ball performance. ALPHA OM-340 is formulated to deliver excellent visual joint cosmetics and best in class in circuit pin test yields. Additionally, ALPHA OM-340’s capability of IPC Class III for voiding and ROL0 IPC classifications ensures maximum long-term product reliability.

1

Zero halogen is defined as no halogen is intentionally added to the formulation

FEATURES & BENEFITS

Maximizes reflow yield for lead-free processing, allowing full alloy coalescence at circular dimensions as small as 200μm (8 mil) with 100μm (4 mil) thick stencils

Excellent print consistency with high process capability index across all board designs.

Print speeds of up to 150mm/sec (6”/sec), enabling a fast print cycle time and a high throughput. Wide reflow profile window with good solderability on various board / component finishes. Excellent solder and flux cosmetics after reflow soldering Best in class low defect rate for Head in Pillow Best in class in circuit pin test yield

Reduction in random solderballing levels, minimizing rework and increasing first time yield Meets highest IPC 7095 voiding performance classification of Class III Excellent reliability properties, halide-free material Compatible with either nitrogen or air reflow

Zero halogen (No halogen intentionally added to the formulation)

PRODUCT INFORMATION

SAC305 (96.5%Sn/3.0%Ag/0.5%Cu) SAC405 (95.5%Sn/4.0%Ag/0.5%Cu)

SACX® Plus 0307 (99%Sn/0.3%Ag/0.7%Cu) SACX® Plus 0807 (98.5%Sn/0.8%Ag/0.7%Cu)

InnoLot (90.95%Sn/3.8%Ag/0.7%Cu/1.4%Sb/0.15%Ni/3%Bi)

For other alloys, please contact your local Cookson Electronics Sales Office. Type 3 (25 - 45μm per IPC J-STD-005) Type 4 (20 - 38μm per IPC J-STD-005)

Type 4.5 (Proprietary Powder Size Distribution) – available upon request Type 5 (15 - 25μm per IPC J-STD-005) – available upon request Approximately 5% by (w/w) Complies with RoHS Directive 2002/95/EC.

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